Introduction of Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement - Panasonic
views
Panasonic introduces Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement that reduces solder cracking and improves the reliability of electronic assemblies in harsh environments like automotive applications.
Related Link
- High heat resistance Secondary mounting Sidefill materials | CV5797 series
https://industrial.panasonic.com/ww/products/electronic-materials/semiconductor-encapsulation/assy-em/hr2ndsf
Related Videos
Recommended Videos
-
ch.02Aug 08, 2022”ECOOL/FELIOS LAB" introduction -Panasonic Industryviews -
ch.02Jul 29, 2022Introduction of LEXCM innovative semiconductor device materials - Panasonicviews -
ch.02Jul 12, 2022Digital Signage Software, EnerVisualizeR - Panasonicviews -
ch.02Jul 12, 2022"Let's start IoT!" by Panasonicviews