Introduction of Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement - Panasonic
views
Panasonic introduces Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement that reduces solder cracking and improves the reliability of electronic assemblies in harsh environments like automotive applications.
Related Link
- High heat resistance Secondary mounting Sidefill materials | CV5797 series
https://industrial.panasonic.com/ww/products/electronic-materials/semiconductor-encapsulation/assy-em/hr2ndsf
Related Videos
Recommended Videos
-
ch.02Apr 01, 2022It's so small, but PhotoMOS. Introducing PhotoMOS CC typeviews -
ch.02Mar 14, 2022PhotoMOS introduction video for the industrial marketviews -
ch.02Feb 16, 2022Introduction of LEXCM innovative semiconductor device materials - Panasonicviews -
ch.02Jan 21, 2022Board to FPC connector for Automotive CF1/CF2-Connection reliability, Reduction of assembly manpowerviews