Introduction of Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement - Panasonic
views
Panasonic introduces Temperature-Resistant Sidefill for Surface Mount Assembly Reinforcement that reduces solder cracking and improves the reliability of electronic assemblies in harsh environments like automotive applications.
#EMBD
#EMBD
Related Link
- High heat resistance Secondary mounting Sidefill materials | CV5797 series
https://industrial.panasonic.com/ww/products/electronic-materials/semiconductor-encapsulation/assy-em/hr2ndsf
